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Deflash - Semiconductors

Process Objective

As a pre-treatment of plating process, the burrs which occurred at resin molding for semiconductor packaging, are removed.

Types of burrs

Dam-burrsSide-burrsFlash-burrs

Burrs that fills out among leads.

Thick burrs aside of leads.

Thinner burrs on leads and heat sink.
It is possible to remove burrs by conventional burr removal method.
Demand for flash-burr removal is increasing due to the technical trends of smaller packaging and thinner product.

Therefore a burr removal with reasonable price and stable quality is necessary.

Problems of flash-burr removal

Benefits of flash-burr removal by wet-blasting

  • 1) Burrs can be perfectly removed by uniform treatment.
  • 2) Package does not become white.
  • 3) Processing power can be controlled with sub-micron order.

The characteristic of Wet-blast

1) By the precision physical cleaning, flash-burrs on electrode plane can be perfectly removed.

Principles of cleaning

Dirt and foreign objects are removed together with the surface of the work piece by the impact given by the energy of particles and water in high speed.

2) Reduction of non-uniform processing by using originally developed wide gun.

Conventional gun

Simultaneous projections by multiple guns.



Non-uniform processing occurs.

Wide gun

Projection by one gun in accordance with the processing width.



It is possible to process the whole surface uniformly.

3) It is possible to suppress damages to the package applied by loose abrasive processing.

Less pressure onto the work piece is applied by continuous pulse processing to its surface

4) It is possible to suppress damages to the surface of the package applied by low pressured micro-particle processing.

Example of flash-burrs

UntreatedAfter Wet-blasting process
Package Surface
Heat sink surface
Heat sink surface
Electron microscope(SEM)
Heat sink surface
Laser microscope

Examples of associated equipment (Mini PFE 100)

Feature

  • Inline processing from wet-blasting to water rinse followed by cutwater is applicable.
  • Whole front /back surface processing is applicable by using our own wide gun.
  • Higher spatial usability by downsizing the cell is realized.
  • Precision physical cleaning using micro-particles are realized.

Process

Spec

Size1200W×1250D×1600H
Work sizeWidth:20-80mm
Length:100-250mm
Thickness:0.1-1.5mm
Acceptable warpage level of work piece:Less than 1mm of center warpage
Conveyor transportation speed0.1-3.0m/min
GunWide Gun 90mm×1.0mm One each for top and bottom
Power supplyAC200V,50/60Hz, 3 phases
Power consumption2.6kW (Total rated apparent power of all the cell)
Air supply pressure0.5MPa or more, 0.7MPa and below
Air consumption4.1m3/min (NTP at 0.25MPa of preset blast air pressure)
Option 

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