Pre-cleaning for gold-plating - Printed Wiring Boards
Surface cleaning technology for improving production yield
Removing SR (solder resist) residue, enhancing gold-plating adhesion, as well as reducing adhesive failure.
- As the material types of foreign objects adhered on the surface are unknown, they cannot be removed by chemical solvents
- Non-uniformity of cleaning occurs on the substrate
- We cannot obtain high throughput performance by plasma treatment
Image of wet-blasting cleaning
Principles of cleaning
Dirt and foreign objects are removed together with the surface of the work piece by the impact given by the energy of particles and water in high speed.