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Pre-cleaning for gold-plating - Printed Wiring Boards

Surface cleaning technology for improving production yield

Process Objective

Removing SR (solder resist) residue, enhancing gold-plating adhesion, as well as reducing adhesive failure.

Problem

  1. As the material types of foreign objects adhered on the surface are unknown, they cannot be removed by chemical solvents
  2. Non-uniformity of cleaning occurs on the substrate
  3. We cannot obtain high throughput performance by plasma treatment

Image of wet-blasting cleaning

Principles of cleaning

Dirt and foreign objects are removed together with the surface of the work piece by the impact given by the energy of particles and water in high speed.