High-speed processing of filler-containing resins by suppressing with less damage to conductors
Processing details
- Scraping
Fine surface processing by wet blasting
Physical processing, which allows the filler-containing resin layer on the build-up substrate surface to be processed uniformly at high speed.
Process Objective
- Surface is exposed by removing near the surface of the substrate on which electric parts are embedded.
- Grinding surface of the resin on the substrate and only circuits are left on it.
Problems of conventional processing method
| Dry Etching (Plasma) |
|
|---|---|
| Laser |
|
| Machining |
|
Process image
The Copper Wiring's Exposure According to Wet-blast
Feature
- Entire surface half-etching for the filler-contained resin
- Process selection of the resin to reduce Copper etching
Processing of materials under court cases
Feature
- Suppressing damages to conductors by using resin particles as well as micro-particles is applicable.
Processing Condition
| Using particle | Alumina A#2000 |
|---|---|
| Air pressure | 0.25MPa |
| Processing Speed | 20mm/s |
| Projecting Angle | 90° |
| Processing number of times | 4-10 passes |
Processing rate control by abrasive type and air pressure is applicable.
Untreated
After 4 passes：Step 0µm
After 6 passes：Step 7µm
After 8 passes：Step 14µm
After 10 passes：Step 20µm※At this time, the amount of Copper being shaved is 0.2µm
Cases of Formation for Embedded Capacitor
Feature
- Patterning that assumed Copper as a mask
- High accuracy by anisotropic processing
