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High-speed processing of filler-containing resins by suppressing with less damage to conductors

Processing details

  • Scraping

Fine surface processing by wet blasting

Physical processing, which allows the filler-containing resin layer on the build-up substrate surface to be processed uniformly at high speed.

Process Objective

    •  Surface is exposed by removing near the surface of the substrate on which electric parts are embedded.
    • Grinding surface of the resin on the substrate and only circuits are left on it.

Problems of conventional processing method

Dry Etching (Plasma)
  • Etching of the filler-contained resin is difficult.
  • It takes longer time to process over ten microns.
  • It takes longer time to process patterning to large area.
  • Desmear is required.
  • Knife is damaged immediately due to the filler.
  • It even over-processes parts and conductors which are necessary.

Process image


The Copper Wiring's Exposure According to Wet-blast


    • Entire surface half-etching for the filler-contained resin
    • Process selection of the resin to reduce Copper etching

Processing of materials under court cases


  • Suppressing damages to conductors by using resin particles as well as micro-particles is applicable.

Processing Condition

Using particle Alumina A#2000
Air pressure 0.25MPa
Processing Speed 20mm/s
Projecting Angle 90°
Processing number of times 4-10 passes


Processing rate control by abrasive type and air pressure is applicable.

filler_7After 4 passes:Step 0µm
6pass後:段差7µmAfter 6 passes:Step 7µm
8pass後:段差14µmAfter 8 passes:Step 14µm
10pass後:段差20µmAfter 10 passes:Step 20µm
※At this time, the amount of Copper being shaved is 0.2µm

Cases of Formation for Embedded Capacitor


  • Patterning that assumed Copper as a mask
  • High accuracy by anisotropic processing

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