High-speed processing of filler-containing resins by suppressing with less damage to conductors
Processing details
- Scraping
Fine surface processing by wet blasting
Physical processing, which allows the filler-containing resin layer on the build-up substrate surface to be processed uniformly at high speed.
Process Objective
- Surface is exposed by removing near the surface of the substrate on which electric parts are embedded.

- Grinding surface of the resin on the substrate and only circuits are left on it.

Problems of conventional processing method
Dry Etching (Plasma) |
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Laser |
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Machining |
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Process image

The Copper Wiring's Exposure According to Wet-blast
Feature
- Entire surface half-etching for the filler-contained resin
- Process selection of the resin to reduce Copper etching

Processing of materials under court cases
Feature
- Suppressing damages to conductors by using resin particles as well as micro-particles is applicable.
Processing Condition
Using particle | Alumina A#2000 |
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Air pressure | 0.25MPa |
Processing Speed | 20mm/s |
Projecting Angle | 90° |
Processing number of times | 4-10 passes |

Processing rate control by abrasive type and air pressure is applicable.





※At this time, the amount of Copper being shaved is 0.2µm
Cases of Formation for Embedded Capacitor
Feature
- Patterning that assumed Copper as a mask
- High accuracy by anisotropic processing
