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High-speed processing of filler-containing resins by suppressing with less damage to conductors

Processing details

  • Scraping

Fine surface processing by wet blasting

Physical processing, which allows the filler-containing resin layer on the build-up substrate surface to be processed uniformly at high speed.

Process Objective

    •  Surface is exposed by removing near the surface of the substrate on which electric parts are embedded.
filler_1
    • Grinding surface of the resin on the substrate and only circuits are left on it.
2.基板上の樹脂表面を、回路部分のみを残し削りこむ

Problems of conventional processing method

Dry Etching (Plasma)
  • Etching of the filler-contained resin is difficult.
  • It takes longer time to process over ten microns.
Laser
  • It takes longer time to process patterning to large area.
  • Desmear is required.
Machining
  • Knife is damaged immediately due to the filler.
  • It even over-processes parts and conductors which are necessary.

Process image

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The Copper Wiring's Exposure According to Wet-blast

Feature

    • Entire surface half-etching for the filler-contained resin
    • Process selection of the resin to reduce Copper etching
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Processing of materials under court cases

Feature

  • Suppressing damages to conductors by using resin particles as well as micro-particles is applicable.

Processing Condition

Using particle Alumina A#2000
Air pressure 0.25MPa
Processing Speed 20mm/s
Projecting Angle 90°
Processing number of times 4-10 passes

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Processing rate control by abrasive type and air pressure is applicable.

未処理Untreated
 
filler_7After 4 passes:Step 0µm
 
6pass後:段差7µmAfter 6 passes:Step 7µm
 
8pass後:段差14µmAfter 8 passes:Step 14µm
 
10pass後:段差20µmAfter 10 passes:Step 20µm
※At this time, the amount of Copper being shaved is 0.2µm
 

Cases of Formation for Embedded Capacitor

Feature

  • Patterning that assumed Copper as a mask
  • High accuracy by anisotropic processing
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