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Overmolded resin removal method that drastically reduces damage to buried LED chips

Processing details

  • Removal

Fine surface processing of LED package by wet blasting

Fine surface processing of LED package by wet blasting


This treatment scraps the overmolding resin (white resin/sealing resin/reflector resin) such as epoxy or silicone on the LED device that covers the chips as a result of LED device manufacturing in order to expose the chips and electrodes. During mass production of small LED devices, the chips are exposed minimizing damage.

It is effective for manufacturing of flip and chip on board (COB) chip LEDs, and can be used to expose chips buried during resin molding.

Features of wet blasting

  • Fine particles are used to minimize damage to the chips and electrodes
  • Easy to control the processing rate by changing the operating air pressure and number of passes
  • The processing time is short because multiple targets can be processed at once.

Picture of processing

Picture of processing

Advantages of wet blasting: Controllability

The abrasive material is mixed with water and treated as a fluid, so the processing rate is highly controllable and it is easy to set the processing strength as required.

Processing Condition

Using particle Alumina A#2000
Air pressure 0.25MPa
Processing Speed 20mm/s
Projecting Angle 90°
Processing number of times 4-10 passes

filler_5

Difference in processing rate between filler-containing resin and Cu

Processing rate control by abrasive type and air pressure is applicable.

未処理Untreated
 
filler_7After 4 passes:Step 0µm
 
6pass後:段差7µmAfter 6 passes:Step 7µm
 
8pass後:段差14µmAfter 8 passes:Step 14µm
 
10pass後:段差20µmAfter 10 passes:Step 20µm
※At this time, the amount of Copper being shaved is 0.2µm
 

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