Processing method to remove thin burrs (flash-burrs) without damaging the LED package
Processing method to remove thin burrs (flash-burrs) without damaging the LED package
Processing details
Washing
Removal
Scraping
Process Objective
By cleaning the burr and dirt on the LED package, the deterioration of the reflection ratio of a reflecting surface can be prevented. The point of contact between LED chip and die pad can be guaranteed.
Problems relating to burr removal
Separation of frame and resin, and breakage of package occur due to high pressure of water-jet processing.
Process image
The characteristic of Wet-blast
１）By the precision physical cleaning, flash-burrs on electrode plane can be perfectly removed.
２）It is possible to suppress damages to the package applied by loose abrasive processing.
Less pressure onto the work piece is applied by continuous pulse processing to its surface
３）It is possible to suppress damages to the surface of the package applied by low pressured micro-particle processing.
