Simultaneous cleaning and base treatment of the substrate surface to enhance the adhesion of gold plating
Processing details
- Washing
- Roughening
Process Objective
Removing SR (solder resist) residue, enhancing gold-plating adhesion, as well as reducing adhesive failure
Problem
- As the material types of foreign objects adhered on the surface are unknown, they cannot be removed by chemical solvents
- Non-uniformity of cleaning occurs on the substrate
- We cannot obtain high throughput performance by plasma treatment
Image of wet-blasting cleaning
Dirt and foreign objects are removed together with the surface of the work piece by the impact given by the energy of particles and water in high speed.
