Substrate plating prewash
Processing Details
- Washing
- Roughening
Process Objective
Removing SR (solder resist) residue, enhancing gold-plating adhesion, as well as reducing adhesive failure.
Problems
- As the material types of foreign matter adhered on the surface are unknown, they cannot be removed by chemical solvents.
- Non-uniformity of cleaning occurs on the substrate.
- High throughput cannot be obtained when processing parts with plasma.
Image of wet blasting cleaning
Using the energy of the water and fine particles colliding with the surface, dirt and foreign matter along with the surface are scraped off the surface of the part.
