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Simultaneous cleaning and base treatment of the substrate surface to enhance the adhesion of gold plating

Processing details

  • Washing
  • Roughening

Process Objective

Removing SR (solder resist) residue, enhancing gold-plating adhesion, as well as reducing adhesive failure

時加工法とは  ウェットブラストによる基板洗浄

Problem

  • As the material types of foreign objects adhered on the surface are unknown, they cannot be removed by chemical solvents
  • Non-uniformity of cleaning occurs on the substrate
  • We cannot obtain high throughput performance by plasma treatment

Image of wet-blasting cleaning

jirei_principle_fig1
Dirt and foreign objects are removed together with the surface of the work piece by the impact given by the energy of particles and water in high speed.

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