Pretreatment for plating to remove burrs without damaging the semiconductors (deflashing)
Processing details
- Removal
Process Objective
As a pre-treatment of plating process, the burrs which occurred at resin molding for semiconductor packaging, are removed.
Types of burrs
Problems of flash-burr removal
Benefits of flash-burr removal by wet-blasting
- Burrs can be perfectly removed by uniform treatment.
- Package does not become white.
- Processing power can be controlled with sub-micron order.
The characteristic of Wet-blast
1）By the precision physical cleaning, flash-burrs on electrode plane can be perfectly removed.
Principles of cleaning
Dirt and foreign objects are removed together with the surface of the work piece by the impact given by the energy of particles and water in high speed.
2）Reduction of non-uniform processing by using originally developed wide gun.
Conventional gun
Simultaneous projections by multiple guns.
Non-uniform processing occurs.
Wide gun
Projection by one gun in accordance with the processing width.
It is possible to process the whole surface uniformly.
3） It is possible to suppress damages to the package applied by loose abrasive processing.
Less pressure onto the work piece is applied by continuous pulse processing to its surface
4）It is possible to suppress damages to the surface of the package applied by low pressured micro-particle processing.
Example of flash-burrs
| Untreated | After Wet-blasting process | |
|---|---|---|
Package Surface |
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Package Surface |
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| Heat sink surface Electron microscope （SEM) |
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| Heat sink surface Laser microscope |
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